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ThinkTank I-7U Blade Server
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Enclosure
Blade Module
Management
Networking
Power Supply


ThinkTank I-7U Blade offers many unique advantages that differentiate it from competitors' blade products and traditional rack-mount solutions. Customer benefits include maximum affordability, minimized footprint, reduced management costs, lower power consumption, optimal ROI, and high scalability - and in most applications, blade servers even reduce acquisition costs.

While current tier-one blade suppliers only offer general-purpose blade servers, the ThinkTank I-7U Blade technology is fully optimized for a wide array of mission-critical and compute-intensive applications. With in-house design engineering agility to accommodate customer needs rapidly, ThinkTank I-7U Blade revolutionizes modular computing architecture by offering several advanced application-optimized models such as Enterprise Blade Server, Data Center Optimized Blade, Workstation Blade and Personal Blade.

ThinkTank I-7U Blade
Offers:

• Best Density in the Industry
• Highest Memory Expansion Capability in the Industry
• Fastest and Most Cost-Effective Networking Solution
• High Efficiency Power for Earth-Friendly Operations
• Outstanding Storage Flexibility
• Peace of Mind via Remote Management
• Unsurpassed TCO



Blade Enclosure


     Enclosure Backview
      Enclosure Frontview


Space Optimization
Housed within a 19" industry-standard rack, the ThinkTank I-7U Blade servers reduce server footprint in the data center. Power, cooling and networking devices are aggregated in the rear of the chassis which optimizes the required amount of space.

Up to ten blade servers can be installed in a 7U chassis. Compared to the 10U of rack space that ten 1U servers would normally require as individual servers, the ThinkTank I-7U provides about 40% improved density with up to 60 total servers in a 42U rack.


Cable Reduction
The ThinkTank I-7U Blade enclosure greatly simplifies the cabling process by aggregating cabling of ten servers at once. Up to 70% of network, power, and KVM cabling required for ten 1U servers are reduced by moving to blade servers in a single chassis. These cabling reductions continue across networking, SAN connectivity, and management controllers.

Reducing the number of cables speeds up the deployment of servers and helps reduce troubleshooting issues by presenting fewer physical connections to the servers.



Enclosure Specifications

Server Blade

Module Support
LED
Infiniband Switch

Gigabit Ethernet Switch
Management Module

Power Supply

Cooling Design
Dimensions (HxWxD)
Available Models

 

  • Up to 10 hot-plug server blades
  (14 blade model coming soon)
• Supports both Intel and AMD based blades
• Power LED, Fault LED
• Up to two hot-plug 4x DDR IB switches with
  built-in management module
• Up to two hot-plug gigbit Ethernet switches
• Up to two hot-plug management modules
  providing remote KVM and IPMI 2.0 functionalities
• Four hot-swap 1400W / 2000W / 2500W
  power supplies, 3+1 redundant
• 16 cooling fans
• 12.1" x 18.5" x 29"
• SBE-710E-R60 - Enclosure chassis with four
  2000W power supplies
• SBE-710E-D40 - Enclosure chassis with two
  2000W power supplies


Blade Module - For Two Quad-Core Processors Configuration


The innovative ThinkTank I-7U Blade touts enhanced system computing density leveraged from years of rackmount server design experience. Each ThinkTank I-7U Blade module delivers true server functionality including up to two Quad-Core Intel® Xeon® processors, 1333MHz FSB, up to 32GB FBD memory, optional InfiniBand mezzanine HCA, and supports either SATA or SAS hard drives.

To protect customer's investment, each blade module is fully upgradeable for future CPUs. The common system architecture ensures each blade is fully inter-changeable as well.



Key Features
• Dual Intel® 64-bit Xeon® Quad-Core
  or Dual-Core, with 667 / 1066 / 1333
  MHz FSB
• Up to 32GB DDR2 667 & 533 SDRAM
  Fully Buffered DIMM (FB-DIMM)
• Intel® (ESB2) 82563EB Dual-port
  Gigabit Ethernet Controller
• 2 x 3.5" Hot-swap Drive Trays
• ATI ES1000 16MB Graphics



Chassis Specifications
Processor/Cache
CPU
• Dual 771-pin LGA Sockets
• Supports up to two Intel® 64-bit   Xeon® processor(s) of the same
  type below:
   • Quad-Core Intel®
     Xeon®Processor 5300      sequence (Clovertown      processor)
up to 2.66 GHz
   • Dual-Core Intel®
     Xeon®Processor 5100/5000      sequence (Woodcrest/
     Dempsey processor)

     up to 3.73 GHz


System Bus
• 1333 / 1066 / 667 MHz system bus

Operating System Software

• Supports 64-bit Operating Systems
• Supports 32-bit Operating Systems

System Memory

Memory Capacity
• Eight 240-pin DIMM sockets
• Supports up to 32 GB
  667/ 533MHz DDR2 ECC
  FB-DIMM   memory
• Dual branch memory bus
• Memory must be populated
  in pairs

Memory Type

• 667 / 533MHz FB-DIMM (Fully Buffered DIMM) ECC DDR2 SDRAM 72-bit, 240-pin gold-plated DIMMs

DIMM Sizes
• 512 MB, 1GB, 2GB, 4GB

Memory Voltage
• 1.8 V only
• 1.5V(AMB)

Error Detection
• Corrects single-bit errors
• Detects double-bit errors
  (using ECC memory)
• Supports Intel® x4 and x8 Single   Device Data Correction (SDDC)

On-Board Devices
Chipset
• Intel® 5000P (Blackford) chipset
• MCH + PXH + ESB2

SATA

• ESB2 SATA Controller
• RAID 0, 1 support

IPMI

• Support for Intelligent Platform   Management Interface v.2.0 via   Chassis Management Module   (CMM)

Network Controllers

• Intel® (ESB2) 82563EB Dual-Port

Gigabit Ethernet Controller
• Supports SerDes   (Serializer/Deserializer)
Intel® I/OAT support for fast,   scaleable, and reliable networking

Graphics
• ATI ES1000 controller with
  16 MB of video memory

Super I/O
• Winbond 83627HF chip

Clock Generator
• CK410B chip
  System BIOS
BIOS Type
• 8Mb Flash EEPROM with   Phoenix® BIOS

BIOS Features
• Plug and Play (PnP)
• SMBIOS 2.3
• DMI 2.1
• PCI 2.2
• ACPI 1.0
• USB Keyboard support
• Hardware BIOS Virus protection


Dimensions
Height
• 11.32" (288 mm)
Width
• 1.67" (42.4 mm)
Depth
• 18.5" (470mm)
Gross Weight
• 8.6 lbs (3.9 kg)
Available Colors
• Black

Front Panel
Buttons
• Power On/Off button
• KVM button
LEDs
• Power LED
• UID / KVM LED
• Network Activity LED
• Fault LED
Connector
• SUV (Serial/USB/Video) & KVM Connector

Drive Bays
Hot-swap
• 2x 3.5"Hot-swap drive bays

Input / Output
IDE
• 1 IDE Slot
InfiniBand
• 2 InfiniBand Slots
KVM
• 1 Front Connector for
  ThinkTank IQ KVM Card
Power
• 2 Power Connectors (to Backplane)
SIMBL
• 1 SIMBL Slot

Operating Environment / Compliance
Environmental Spec.
• Operating Temperature:
  10º to 35º C (50º to 95º F)
• Non-operating Temperature:
  -40º to 70º C (-40º to 158º F)
• Operating Relative Humidity:
  8% to 90% (non-condensing)
• Non-operating Relative Humidity:
  5 to 95% (non-condensing)
 
Electromagnetic Compatibility (EMC)
United States / Canada
• FCC- Emissions (US) Verification
Europe
• EN55022 - Emissions
• EN55024 - Immunity
• EN61000-3-2 - Harmonics
• EN61000-3-3 - Voltage Flicker
• CE - EMC Directive 89/336/EEC
Germany
• TUV
 
Safety Compliance
United States / Canada
• UL60950-1 - CSA/CUL 60950-1
Europe
• EN60950-1, CE -
  Low Voltage Directive 73/23/EEE


Blade Module - For Four Quad-Core Processors Configuration


Key Features
•  Four Quad-Core / Dual-Core
   AMD Opteron™ 8000 Series (Socket F)
•  Up to 64GB DDR2 667 SDRAM
   Up to 32GB DDR2 533 SDRAM
   Up to 64GB DDR2 400 SDRAM
•  Intel 82546GB Dual-port Gigabit LAN/Ethernet Controller
•  1 x 2.5" Internal SATA Drive Support
•  ATI ES1000 16MB Graphics



Chassis Specifications
Motherboard
Super BHQME
 
Processor/Chipset
CPU
• Quad 1207-pin Socket F
• Supports up to four Quad-Core /   Dual-Core AMD Opteron™ 8000   Series (Socket F) processor(s)
System Bus
• 1000MHz HyperTransport
Chipset
• nVidia MCP55 Pro
 
System Memory
Memory Capacity
• Sixteen 240-pin DIMM sockets
• Supports up to
   64 GB DDR2 667 MHz memory
• Supports up to
   32 GB DDR2 533 MHz memory
• Supports up to
   64 GB DDR2 400 MHz memory
• Single or Dual (recommended)   channel memory support
• For Quad CPUs: Recommended   that memory be populated equally
  in adjacent memory banks
Memory Type
• DDR2 667/533/400MHz buffered   (registered) ECC SDRAM 72-bit,
  240-pin gold-plated DIMMs
DIMM Sizes
• 256MB, 512MB, 1GB, 2GB, 4GB
Memory Voltage
• 1.8V only
Error Detection
• Corrects single-bit errors
• Detects double-bit errors (using ECC memory)
 
On-Board Devices
SATA
• nVidia MCP55 Pro
  SATA2 3.0Gbps Controller
• 6 SATA2 Ports
• nVidia RAID 2.0
• SATA RAID 0, 1, 0+1, 5,
  JBOD Support
IPMI
• Support for Intelligent Platform   Management Interface v.2.0 via   Chassis Management Module   (CMM)
Network Controllers
• Intel® (ESB2) 82563EB Dual-Port   Gigabit Ethernet PHY Controller
• Supports SerDes   (Serializer/Deserializer)
• Intel® I/OAT support for fast,   scaleable, and reliable networking
Super I/O
• Winbond 83627HF
VGA
• ATI ES1000 Graphics Controller
 
System BIOS
BIOS Type
• 8Mb Flash EEPROM with
  AMI® BIOS
• SST 49LF080A BIOS Chip
BIOS Features
• Plug and Play (PnP)
• DMI 2.3
• PCI 2.2
• ACPI 2.0
• USB Keyboard Support
• SMBIOS 2.3
  Dimensions
Height
• 11.32" (288 mm)
Width
• 1.67" (42.4 mm)
Depth
• 18.5" (470mm)
Gross Weight
• 8.6 lbs (3.9 kg)
Available Colors
• Black
 
Front Panel
Buttons
• Power On/Off button
• KVM button
LEDs
• Power LED
• UID / KVM LED
• Network Activity LED
• Fault LED
Connector
• SUV (Serial/USB/Video) & KVM Connector
 
Hard Drive Support
Internal
• 1x 2.5" Fixed SATA Hard Drive Support
 
Input / Output
IDE
• 1 IDE Slot
InfiniBand
• 2 InfiniBand Slots
KVM
• 1 Front Connector for Supermicro KVM Card
Power
• 2 Power Connectors (to Backplane)
SIMBL
• 1 SIMBL Slot
 
Operating Environment / Compliance
Environmental Spec.
• Operating Temperature:
  10º to 35º C (50º to 95º F)
• Non-operating Temperature:
  -40º to 70º C (-40º to 158º F)
• Operating Relative Humidity:
  8% to 90% (non-condensing)
• Non-operating Relative Humidity:
  5 to 95% (non-condensing)
 
Electromagnetic Compatibility (EMC)
United States / Canada
• FCC- Emissions (US) Verification
Europe
• EN55022 - Emissions
• EN55024 - Immunity
• EN61000-3-2 - Harmonics
• EN61000-3-3 - Voltage Flicker
• CE - EMC Directive 89/336/EEC
Germany
• TUV
 
Safety Compliance
United States / Canada
• UL60950-1 -
  CSA/CUL 60950-1
Europe
• EN60950-1, CE -
  Low Voltage Directive 73/23/EEE



Blade Management


The ThinkTank I-7U Blade chassis management module (CMM) provides total remote control of individual server blades, power supplies, cooling fans, and networking switches remotely. System administrators enjoy the management ease and reassurance of continuous onboard instrumentation monitoring (temperature sensors, power status, voltages and fan speed). Remote power control capabilities to reboot and/or reset the server are available as well as remote access to the BIOS configuration and operating system console information vial SOL (Serial over LAN) or embedded KVM capabilities. Because the controller is a separate processor, all monitoring and control functions operate flawlessly regardless of CPU operation or system power-on status.


Chassis Management Module Features
• Remotely manage and monitor server blades, power supplies,
  cooling fans, and networking switches
• IPMI 2.0 compliant, with KVM over LAN / KVM over IP
• Serial over LAN (SOL)
• Virtual Media Over LAN (Virtual USB Floppy/CD and Drive Redirection)
• LAN Alert-SNMP Trap
• Event Log
• OS Independent
• Hardware Health Monitor
• Remote Power Control
• Management Tools - IPMIView, CLI (Command Line Interface)<
• Supports RMCP & RMCP + Protocols

Specifications
• VGA Port, 2x USB Ports
• Remote Management Processor and sub-system
• 1x LAN port
• Video ADC, Video Compress FPGA
• I2C, IPMI Management
• 12V Hot-swap Controller
• GBX Backplane Connector



Blade Networking



Gigabit Ethernet Switch
GEM001

Chipset • Broadcom BCM5345M
Internal Ports
• Ten 1-Gbps downlink ports for LAN interfaces
  of the server blades (capable of 14 internal ports)
External Uplink Ports
• Ten 1-Gbps uplink RJ-45 ports
Type
• Layer-2 switch
Bandwidth
• 21 Gbps non-blocking
Trunking
• Link aggregation support
Jumbo Frame Support
• Up to 9k bytes
Remote Management
• Browser-based management
Protocols
• Spanning Tree, Rapid Spanning Tree, and Multiple
  Spanning Tree protocols (802.1D/1s/1w)
OS
• Firmware upgradeable

Infiniband Solutions
IBD-001 (IB Switch)

 
Chipset
• Mellanox InfiniScale III
Internal Ports
• Ten 4x DDR internal copper ports (capable of 14)
External Uplink Ports
• Ten 4x DDR external copper ports
Bandwidth
• 4x DDR (20Gbps) non-blocking architecture 960Gbps
  total switch bandwidth (24-port)
Latency
• 160ns port-to-port switch latency
Management
• In-band InfiniBand IBML, Command-Line Interface (CLI)
Power Consumption
• 34W
 
IBH-001 (Mezzanine HCA)
 
Chipset
• Mellanox InfiniHost III Ex DDR
InfiniBand Ports
• Dual 4x DDR 20Gbps ports
Power Consumption
• 10.4W typical/ 11W max


Blade Power Supply & Cooling



One of the biggest benefits of moving to a blade environment is the relocation of power supplies and fans into a single chassis versus an individual set in each server. This greatly helps reduce the power requirements on a per server basis.

Engineers have mastered the power supply design challenge to produce high-quality, high-performance solutions with peak efficiency ratings of 90% or higher.


High-efficiency Blade Power Supply
Key Advantages


• Availability - Non-stop power with 3+1 redundant power supply modules
• Cost Saving - At 90%+ peak efficiency, power consumption is significantly reduced,
  providing a planet-friendly, real-world advantage for our environment.
• Investment Protection - Power capacity headroom for future generation processors
• Easy Installation - Snap-in installation from the back of the chassis;
  hot-swappable in operation
• Intelligent Power Infrastructure - Each power enclosure includes a power
  management module that monitors the power supplies and the power
  enclosure that connects to the blade management.


PWS-1K41-BR Power Supply
Output
 • 1400W
Type
• Redundant Module (3+1)
+12V
• 116A (200~240VAC input)
• 100A (100~140VAC input)
5VSB
• 16A
PFC
• Yes
Peak Efficiency
• 90%+
Input AC Range
• 100~240VAC
Operating Conditions
• Temp: -5 to 50°C
• Humidity: 5 to 95% RH
Fan Type

• 2x 90mm fans
• PFC0912DE-6L38 (8000 RPM with PWM)

PWS-2K01-BR Power Supply
 
Output
• 2000W
Type
• Redundant Module (3+1)
+12V
• 167A
5VSB
• 16A
PFC
• Yes
Peak Efficiency
• 90%
Input AC Range
• 200~240VAC
Operating Conditions
• Temp: -5 to 50°C
• Humidity: 5 to 95% RH
Fan Type
• 4x 90mm fans
• PFB0912DHE-6X39 (8000 RPM with PWM)
• QFR0912UHE-6F78 (8300 RPM with PWM)

PWS-2K51-BR Power Supply
 
Output
• 2500W
Type
• Redundant Module (3+1)
+12V
• 208A
5VSB
• 16A
PFC
• Yes
Peak Efficiency
• 90%+
Input AC Range
• 200~240VAC
Operating Conditions
• Temp: -5 to 50°C
• Humidity: 5 to 95% RH
Fan Type • 4x 90mm fans
• PFC0912DE-6L38 (8000 RPM with PWM)
• QFR0912UHE-6F78 (8300 RPM with PWM)




For additional information, options and pricing about our ThinkCP™ products,
please contact our sales representatives -
(800)726-2477 or email -

SalesDesk AT ThinkCP.com



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